IPG Laser YLP-HP-1-30x240-200-200 90-240IPG Photonics
Ytterbium Fiber Laser
IPG Laser YLP-HP-1-30x240-200-200 90-240
IPG Photonics
Ytterbium Fiber Laser
EXW Prix fixe hors TVA
25 000 €
État
Neuf
(entièrement fonctionnel)
Emplacement
Töltéstava 

Données de base
- Désignation de la machine:
- IPG Laser YLP-HP-1-30x240-200-200 90-240
- Fabricant:
- IPG Photonics
- Modèle:
- Ytterbium Fiber Laser
- État:
- nouveau
- Fonctionnalité:
- entièrement fonctionnel
Prix et localisation
EXW Prix fixe hors TVA
25 000 €
- Emplacement:
- Töltéstava, Hongrie

Détails sur l'offre
- Identifiant de l'annonce:
- A21991053
- Mise à jour:
- dernière mise à jour le 25.05.2026
Description
Laser Core Identification
YLP: Ytterbium Laser Pulsed. This identifies it as a pulsed nanosecond fiber laser operating in the near-infrared spectrum (typically 1064 nm wavelength).
HP: High Power. Indicates the heavy-duty sub-series designed for fast processing speeds and high ablation rates compared to the standard, low-power desktop marking modules.
1: Indicates the Optical Beam Quality (\(M^{2}\)) standard or series generation (typically targeting a beam parameter product near \(M^2 \leq 2.0\) for clean, tight focal spots).
Bsdpfx Ahjy Udyqekslp
30x240: Pulse Width / Duration Configuration. Refers to its tunable or specific pulse length capability (in nanoseconds), optimizing it for balancing rapid material removal without massive heat-affected zones.
200-200: Defines the power metrics.200 W Average Output Power: Capable of sustaining continuous pulsed work at 200 Watts.
200 kHz Pulse Repetition Rate (PRR): The maximum frequency of the laser pulses, determining how quickly it can scribe or clean surfaces.
Electrical Requirements (90-240 VAC)
Power Input: Features a universal, autoranging power supply unit (PSU). It safely plugs directly into standard global wall grids spanning 90V to 240V AC (Single Phase, 50/60 Hz) without needing heavy industrial 3-phase transformers.
Core Applications
Because of its high 200W power and high-frequency pulsed delivery, this model is typically integrated into CNC machinery or robotic cells for:
High-Speed Laser Cleaning / Ablation: Removing rust, paint, oxides, and coatings from metals without damaging the base substrate.
Deep Laser Engraving & Marking: Precision engraving on hard metals, ceramics, and highly reflective materials (like aluminum or copper).
Silicon / Solar Panel Scribing: High-throughput cutting or edge deletion tasks in manufacturing.
Brand new never used. Please check out our other listings as well.
YLP: Ytterbium Laser Pulsed. This identifies it as a pulsed nanosecond fiber laser operating in the near-infrared spectrum (typically 1064 nm wavelength).
HP: High Power. Indicates the heavy-duty sub-series designed for fast processing speeds and high ablation rates compared to the standard, low-power desktop marking modules.
1: Indicates the Optical Beam Quality (\(M^{2}\)) standard or series generation (typically targeting a beam parameter product near \(M^2 \leq 2.0\) for clean, tight focal spots).
Bsdpfx Ahjy Udyqekslp
30x240: Pulse Width / Duration Configuration. Refers to its tunable or specific pulse length capability (in nanoseconds), optimizing it for balancing rapid material removal without massive heat-affected zones.
200-200: Defines the power metrics.200 W Average Output Power: Capable of sustaining continuous pulsed work at 200 Watts.
200 kHz Pulse Repetition Rate (PRR): The maximum frequency of the laser pulses, determining how quickly it can scribe or clean surfaces.
Electrical Requirements (90-240 VAC)
Power Input: Features a universal, autoranging power supply unit (PSU). It safely plugs directly into standard global wall grids spanning 90V to 240V AC (Single Phase, 50/60 Hz) without needing heavy industrial 3-phase transformers.
Core Applications
Because of its high 200W power and high-frequency pulsed delivery, this model is typically integrated into CNC machinery or robotic cells for:
High-Speed Laser Cleaning / Ablation: Removing rust, paint, oxides, and coatings from metals without damaging the base substrate.
Deep Laser Engraving & Marking: Precision engraving on hard metals, ceramics, and highly reflective materials (like aluminum or copper).
Silicon / Solar Panel Scribing: High-throughput cutting or edge deletion tasks in manufacturing.
Brand new never used. Please check out our other listings as well.
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